Global 3D IC Market 2014-2018: Key Vendors are Advanced Semiconductor Engineering, Samsung, STMicroelectronics and Taiwan

A 3D IC is an IC with multiple layers (more than two) of active electronic components which are integrated into a single circuit. These layers are integrated both vertically and horizontally. 3D ICs are the perfect solution for meeting the growing demand to minimize the size and reduce the cost of products in the Consumer Electronics segment.

The transistor density is greater in 3D ICs than that in other ICs, which means that 3D ICs offer better performance. 3D technology emerged as a result of the continuous advancements being made in IC design. Some of the major applications of 3D ICs are in memory products (flash and DRAM), sensors, LEDs, and MEMS systems.

The analysts forecast the Global 3D IC market to grow at a CAGR of 18.4 percent over the period 2013-2018.

This report covers the present scenario and the growth prospects of the Global 3D IC market for the period 2014-2018. The report includes the overall revenue generated from the sales of 3D ICs. The 3D ICs that are discussed in this report are developed by using through-silicon via (TSV) interconnect technology.

The report also presents the vendor landscape and a corresponding detailed analysis of the top four vendors in the Global 3D IC market. In addition, the report discusses the major drivers that influence the growth of the Global 3D IC market. It also outlines the challenges faced by the vendors and the market at large, as well as the key trends that are emerging in the market.

One of the major trends upcoming in this market is the multi-chip packaging of 3D ICs, which allows the incorporation of numerous transistors. Multi-chip packaging has revolutionized the packaging method used for ICs.

According to the report, one of the major growth drivers in this market is an increase in demand for 3D ICs in memory products such as flash memory and DRAM. 3D ICs improve the performance and reliability of memory products and also reduce their cost and size.

Further, the report states that one of the major challenges that the market faces is thermal conductivity issues associated with 3D ICs. The thermal conductivity of 3D ICs is low, which adversely affects the performance and durability of end-products.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

Key Topics Covered:

01. Executive Summary

02. List of Abbreviations

03. Scope of the Report

04. Market Research Methodology

05. Introduction

06. Market Landscape

07. Market Segmentation by Product

08. Market Segmentation by End-users

09. Geographical Segmentation

10. Key Leading Countries

11. Buying Criteria

12. Market Growth Drivers

13. Drivers and their Impact

14. Market Challenges

15. Impact of Drivers and Challenges

16. Market Trends

17. Trends and their Impact

18. Vendor Landscape

19. Key Vendor Analysis

20. Market Summary

21. Other Reports in this Series

Companies Mentioned:

For more information visit http://www.researchandmarkets.com/research/kpcrs9/global_3d_ic

Media Contact: Laura Wood , +353-1-481-1716, [email protected]