GIGABYTE Redefines Intel and AMD B800 Series Motherboards Performance with AI Technology at CES 2025

GIGABYTE B860 and B850 motherboards feature all digital power design and premium thermal solution with a unique heatsink that improves the cooling surface up to 4 times, combined with heat pipes, and high thermal conductivity pads for superior cooling efficiency. Focusing on user-friendly features for an easy PC build experience, GIGABYTE includes complete DIY-friendly innovations from PCIe EZ-Latch Plus, and M.2 EZ-Latch Click to WIFI EZ-PLUG onboard for a hassle-free installation.

Alongside high-end AORUS PRO and ELITE, GIGABYTE GAMING(X), and EAGLE models, GIGABYTE offers the ICE series featuring a comprehensive white aesthetic with pure white PCB, memory DIMM slots, PCIe slots, connectors, and a debug port delivering a complete solution for white build enthusiasts. Not only catering to gamers' needs, the GIGABYTE B850 AI TOP is also compatible with GIGABYTE's AI TOP utility for local AI fine-tuning. Visit GIGABYTE EVENT | CES 2025 for more info on GIGABYTE B800 series motherboards.

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