E&R Showcases Next-Gen Laser and Plasma Solutions with Strategic Partners at SEMICON SEA 2025 in Singapore

Featured Technologies from E&R:

Plasma Dicing – Small Die Dicing Solution
E&R delivers a hybrid laser grooving and plasma dicing solution that supports ultra-fine dice lanes (10–30 μm). Beyond equipment, E&R also provides a turnkey dicing service, handling unique shapes like hexagons, circles, or MPR layouts with precision and consistency.

FOPLP – Fan-Out Panel Level Packaging (700 × 700 mm)
E&R's total solution supports large panel processes including laser marking, laser cutting, laser descum, plasma cleaning, and post-drill de-smear, with a remarkable warpage control up to 16 mm. The process is further enhanced with laser debonding and plasma dry etching solutions for separation of glass carrier and panel.

Glass Substrate Solutions
E&R leads in glass core process equipment, offering:

Advanced Packaging

Join us at SEMICON SEA 2025 to see how E&R, Zen Voce, and GP Group are driving the future of semiconductor manufacturing — with more precise, efficient, and integrated solutions.

Booth Information

View original content:https://www.prnewswire.co.uk/news-releases/er-showcases-next-gen-laser-and-plasma-solutions-with-strategic-partners-at-semicon-sea-2025-in-singapore-302450963.html